iMAPS Iberia Summit 2026
11–12 June 2026 · Barcelona

iMAPS Iberia Summit 2026 & Microelectronic Workshop

Innovation in Microelectronic & Advanced Packaging Technologies

  • Format Summit + technical workshop
  • Location Barcelona
  • Language English

The event brings together companies, organizations, and professionals from the microelectronics ecosystem to share innovation, use cases, technology demonstrations, and networking opportunities around advanced packaging and microelectronics.

Key Topics

Wire bonding, 3D microdispensing, microchannels, repair PCB, wafer treatment process and advanced packaging.

Dynamic Format

Presentations, demo tours, roundtable, workshop with zone rotations and high-value networking.

First Edition

A proposal designed to showcase industrial innovation and connect the Iberian ecosystem with European stakeholders.

General Information

What it is

The iMAPS Iberia Summit 2026 & Microelectronic Workshop combines an industry summit with a technical workshop focused on microelectronics and advanced packaging technologies. The content is structured to provide strategic vision, applied demonstrations, and professional connections.

What you will find

  • Institutional and technical presentations.
  • Poster sessions and roundtable with ecosystem organizations.
  • Machine demo tours and workshop with group rotations.
  • Networking spaces, cultural activity, and optional dinner.

Technology Areas

Wire Bonding 3D Microdispensing Microchannels Repair PCB Wafer Treatment Chiplet Integration Test Vision Inspection

Useful Information

  • Dates: June 11–12, 2026.
  • Format suitable for attendees with technical and industrial profiles.
  • Optional evening networking activity with beach dinner featuring Spanish and Catalan cuisine.
  • Access to the day 2 workshop is organized by rotating groups.

Agenda

Check the program for each day and discover the main content blocks of the event.

  • 08:30 – 09:00
    Welcome Reception & CoffeeWelcome reception and coffee.
  • 09:00 – 09:30
    Institutional PresentationsInstitutional opening of the event.
  • 09:30 – 11:00
    Research Technological Advanced Packaging PresentationsPoster session and networking.
  • 11:00 – 11:30
    Coffee BreakCoffee break.
  • 11:30 – 12:50
    Micro-Assembly and Packaging Processes PresentationsTPT, ioTech, XTPL, Nordson Asymtek and SPEA present wire bonding, additive laser microdispensing, repair PCB, plasma treatment and the importance of semiconductor testing.
  • 12:50 – 13:30
    Live Process Demo TourMachine demonstration tour.
  • 13:30 – 14:30
    Lunch BreakLunch.
  • 14:30 – 15:20
    Micro-Assembly and Packaging Processes PresentationsMSTECH Europe, ADT and Valtria present semiconductor inspection, wafer treatment process and cleanroom design and construction.
  • 15:20 – 16:00
    Live Process Demo TourSecond demo round.
  • 16:00 – 16:20
    Coffee BreakCoffee break.
  • 16:20 – 17:00
    RoundtableAdvanced Packaging in Europe: Skills, Strategy and Infrastructure: Advanced Packaging Training, ESRA Presidency & APECS Pilot Line.
  • 17:00 – 17:30
    Wrap-Up & Closing DiscussionClosing and conclusions.
  • 17:30 – 19:30
    Cultural ActivityCultural activity in Vilanova i la Geltrú.
  • 20:00 –
    Beach Dinner (optional)Optional beach dinner.
  • 08:30 – 09:00
    Welcome Reception & CoffeeWelcome reception and coffee.
  • 09:00 – 09:30
    AESEMIIntroduction to the technical day.
  • 09:30 – 13:30
    Technical Demos · Group Rotation and Exhibitor AreaRotations across 3 parallel zones with XTPL, ioTech, Valtria, MSTECH Europe, TPT, SPEA, ADT, Nordson Asymtek and Nordson March.
  • 09:30 – 10:30
    Round 1Zone 4 (Clean Room): Group 1 | Zone 5 (Chiplet Area): Group 2 | Zone 6 (Demo Room): Group 3.
  • 10:30 – 11:30
    Round 2First group rotation between zones.
  • 11:30 – 12:30
    Round 3Second group rotation.
  • 12:30 – 13:30
    Exhibitor AreaExhibition and Networking Area.
  • 13:30 – 14:30
    Lunch Catering & NetworkingInformal workshop closing.

Speakers

Companies and organizations participating in the technical sessions, demonstrations, and collaboration spaces of the event.

Tobias Hickmann

TPT

Presentations and demos related to wire bonding technology and bonding processes.

Stéphane Etienne

ioTech

Specialist in additive laser microdispensing and advanced deposition solutions.

Kamelia Kowalczewska

XTPL

Participation in repair PCB, UPD and Delta Printing System within the technical workshop.

Maarten Haegdorens

Nordson Asymtek

Plasma treatment and fluid dispensing in demos and applied sessions.

Jesus Rubio González

MSTECH Europe

Technical content related to semiconductor inspection and SEMINFINITY systems.

Yossi Gershon

ADT

Wafer treatment process and dicing system in presentations and demo rotations.

Fabio Sollazzo

SPEA

Testing Challenges for the Diversified Semiconductor Industry.

Maarten Haegdorens

Nordson March

Presence in the technical rotations together with Nordson Asymtek.

Fernando Cajal

Valtria

Cleanroom design and construction.

AE

AESEMI · MNS · SMT · ONIZEA

Partners and organizations linked to the organization and promotion of the event.

Registration

Check the official registration and secure your participation in the event.

Reserve your spot

Access the official Eventbrite page to check availability, ticket types and complete your registration for the iMAPS Iberia Summit 2026 & Microelectronic Workshop.

  • 11–12 June 2026 · Barcelona
  • Industry summit + technical workshop
  • Networking, demos and specialized content
  • Cultural activity and optional dinner on day 1

Online Registration

Click the button to open the official registration form in a new tab.

Go to Eventbrite

Registration available through the official Eventbrite platform.